AOYUE WQ/LF-12D Soldering Tip Ø1.2mm x 0.5mm Soldering Station

PCBs and plates can be easily and safely fixed with the Aoyue 328 Working Platform without using a "third hand" that could damage components or other circuit paths. The brass spindle of the Working Platform can be adjusted by means of knurled plastic wheel. The Working Platform has more storage possibilities for tools (see product pictures) so that the working place is tidied up and the tool is always there where it is needed. The jaws (metal plate holder) of the Working Platform are not made of plastic but of metal so that when hot air is applied no damage may occur.

- sure fixing of the chip for the reballing - sure and clean reballing with a low cost expenditure - about 50 further models available Place the stencil template that matches precisely the pitch pattern of the BGAs. Spread the solder balls on the solder pads. If all pads have received a solder ball, remove the excess balls. The solder balls can melt only on the solder pads. After the stencil template and the BGA’s have been cooled down, the stencil template ca be removed.

This product leaves the range, as we want to make room for new products. We are happy to advise you if you need an alternative for this station. The spare parts will be available in future. The platform Aoyue 618 allows you to work easily and safely on the pc board. The fixing screws sustain the pc board safely on the holder/support. The holder of the versatile working platform allows you to set the required distance between the clamped hot air gun and the pc board without problems. This way you have the possibility to establish a precise adjustment to reach an always constant soldering result. While working with the platform you need both free hands to work on the pc board or to make the settings on the hot air station. The pillar of the holder is hard chrome plated to protect the surface.

• sure fixing of the chip for the reballing • sure and clean reballing with a low cost expenditure • about 50 further models available Place the stencil template that matches precisely the pitch pattern of the BGAs. Spread the solder balls on the solder pads. If all pads have received a solder ball, remove the excess balls. The solder balls can melt only on the solder pads. After the stencil template and the BGA’s have been cooled down, the stencil template ca be removed.

- sure fixing of the chip for the reballing - sure and clean reballing with a low cost expenditure - about 50 further models available Place the stencil template that matches precisely the pitch pattern of the BGAs. Spread the solder balls on the solder pads. If all pads have received a solder ball, remove the excess balls. The solder balls can melt only on the solder pads. After the stencil template and the BGA’s have been cooled down, the stencil template ca be removed.

- sure fixing of the chip for the reballing - sure and clean reballing with a low cost expenditure - about 50 further models available Place the stencil template that matches precisely the pitch pattern of the BGAs. Spread the solder balls on the solder pads. If all pads have received a solder ball, remove the excess balls. The solder balls can melt only on the solder pads. After the stencil template and the BGA’s have been cooled down, the stencil template ca be removed.

- sure fixing of the chip for the reballing - sure and clean reballing with a low cost expenditure - about 50 further models available Place the stencil template that matches precisely the pitch pattern of the BGAs. Spread the solder balls on the solder pads. If all pads have received a solder ball, remove the excess balls. The solder balls can melt only on the solder pads. After the stencil template and the BGA’s have been cooled down, the stencil template ca be removed.

- sure fixing of the chip for the reballing - sure and clean reballing with a low cost expenditure - about 50 further models available Place the stencil template that matches precisely the pitch pattern of the BGAs. Spread the solder balls on the solder pads. If all pads have received a solder ball, remove the excess balls. The solder balls can melt only on the solder pads. After the stencil template and the BGA’s have been cooled down, the stencil template ca be removed.

- sure fixing of the chip for the reballing - sure and clean reballing with a low cost expenditure - about 50 further models available Place the stencil template that matches precisely the pitch pattern of the BGAs. Spread the solder balls on the solder pads. If all pads have received a solder ball, remove the excess balls. The solder balls can melt only on the solder pads. After the stencil template and the BGA’s have been cooled down, the stencil template ca be removed.

This model 927 distinguishes itself by colourfast light, whereby no irritations can occur. The lamp is best suitable for the deciphering of small components on the board or for soldering without additional aids.The LED lamp can be used for checking if the joints on the board have flaws, which is not possible with the normal eye. It has an incredibly low energy consumption of 2-3 Watt, through which a contribution to environmental protection and money saving is achieved. The Aoyue 929 is additionally equipped with a lamp cover, which protects the lamp against damage and dirt.

The indispensable tool for lab and every workshop. It is a cold light magnifier produced by AOYUE. This model 929 distinguishes itself by colourfast light, whereby no irritations can occur. The lamp is best suitable for the deciphering of small components on the board or for soldering without additional aids. The lamp can be used for checking if the joints on the board have flaws, which is not possible with the normal eye. It has an incredibly low energy consumption of 25 Watt, through which a contribution to environmental protection and money saving is achieved. The Aoyue 929 is additionally equipped with a lamp cover, which protects the lamp against damage and dirt.

The 932 model is characterised by its continuous and high suction power and its high vacuum volume. Chips weighing 3–40 g can be lifted with this device without any problems. The device is ideally suitable for lifting components off the circuit board when unsoldering. The vacuum pen is made of aluminum, ergonomically shaped, and has an opening that you simply close with your finger as long as you want to keep the component lifted. If the component is to be lowered, simply let go of the opening. This station is indispensable for chip tuning, circuit board repairs, and cell phone repairs.The station comes with a transport lock (red Phillips screw that secures the pump during transport), which must be removed BEFORE switching it on for the first time! The system is then completely ready for use.

This kit Set comprises all you need in order to upgrade the Aoyue stations 852a++ (WilTec-Art. 90852A++); 968 (WilTec-Art. 90968); 968A+ (WilTec-Art. 90968A+); 2702A+ (WilTec-Art. 902702); 2703A+ (WilTec-Art. 902703A+) with a practical vacuum pick up kit. The vacuum pickup kit replaces the smoke absorber, that means you can choose between the two usages by simply reconnecting the hose. You will also receive suction caps that allow you to lift/remove chips and components between 3 - 40g from the circuit board when desoldering. You will receive a vacuum pickup kit. The delivery also includes 3 suction, a screw adapter (22 mm inside thread) and a hose (length: 1.20m Ø 5mm)

The cheap solder fume extraction system from Aoyue, the Aoyue 933 Smoke Absorber. The equipment has two washable filter elements which retain floating particles.With all soldering processes harmful fumes and gases are generated because of the employed solder fluxes. The smoke absorber complies with the workplace regulations stipulated in paragraph § 53 of the German law, and helps to prevent illnesses of the respiratory tract !The use of the solder fume extraction system is neccessary, if one takes into account quality aspects, the above mentioned characteristic and the solder flux precipitation on printed circuit boards, which can lead to problems.The fume extraction kann can be turned on by means of switcher. The equipment can be recommended to all those who solder regularly.

The AOYUE 939 vacuum pick-up pen is characterszed by its high suction volume. Chips weighing 3–40 g can be lifted with this device without any problems. This vacuum pen is ideally suitable for lifting components off the circuit board when unsoldering.Replacement rubber grips can be found in our shop.

AOYUE [1125] Hot Air Nozzle QFP 10x10mm Rework Station Reconciling also compatibly to Hakko, Xytronic and Gordak devices. Please also see our other spare parts. If you need help with a fault of your Aoyue product, simply contact us. We're here to help YOU!

AOYUE [1126] Hot Air Nozzle 15.2mm Rework Station Reconciling also compatibly to Hakko, Xytronic and Gordak devices. Please also see our other spare parts. If you need help with a fault of your Aoyue product, simply contact us. We're here to help YOU!

AOYUE [1127] Hot Air Nozzle 19.2mm Rework Station Reconciling also compatibly to Hakko, Xytronic and Gordak devices. Please also see our other spare parts. If you need help with a fault of your Aoyue product, simply contact us. We're here to help YOU!

AOYUE [1128] Hot Air Nozzle QFP. 14x20mm Rework Station Reconciling also compatibly to Hakko, Xytronic and Gordak devices. Please also see our other spare parts. If you need help with a fault of your Aoyue product, simply contact us. We're here to help YOU!

AOYUE [1132] Hot Air Nozzle SOP 5.6x13mm - SMD Rework Station Rework StationHot air nozzles for standard hot air stations and SMD Rework-Stations with 22mm connection widthPlease make sure, that you choose the right size for your component.Round nozzles can be used for many applications. In the case of nozzles that are used for certain components (for example SOP, BGA, PLCC... you have to choose the appropriate nozzle for your component, so that an inappropriate nozzle does not damage your components.Please also see our other spare parts. If you need help with a fault of your Aoyue product, simply contact us. We're here to help YOU!

AOYUE [1133] Hot Air Nozzle SOP 7.2mm Rework Station Reconciling also compatibly to Hakko, Xytronic and Gordak devices. Please also see our other spare parts. If you need help with a fault of your Aoyue product, simply contact us. We're here to help YOU!

AOYUE [1134] Hot Air Nozzle SOP 7.2mm Rework Station Reconciling also compatibly to Hakko, Xytronic and Gordak devices. Please also see our other spare parts. If you need help with a fault of your Aoyue product, simply contact us. We're here to help YOU!

AOYUE [1135] Hot Air Nozzle 18.5mm Rework Station Reconciling also compatibly to Hakko, Xytronic and Gordak devices. Please also see our other spare parts. If you need help with a fault of your Aoyue product, simply contact us. We're here to help YOU!

AOYUE [1136] Hot Air Nozzle PLCC 20x20mm Rework Station Reconciling also compatibly to Hakko, Xytronic and Gordak devices. Please also see our other spare parts. If you need help with a fault of your Aoyue product, simply contact us. We're here to help YOU!

Use only if this tip was already installed.You receive a desoldering tip with a nozzle bore of Ø 0.6 mm from Aoyue.Please also note our further spare parts.If you need help in case of malfunction of your Aoyue product, please contact us. We are delighted to help you !

Use only if this tip was already installed.You receive a desoldering tip with a nozzle bore of Ø 0.8 mm from Aoyue.Please also note our further spare parts.If you need help in case of malfunction of your Aoyue product, please contact us. We are delighted to help you !

Solder wire for hand soldering and automatic soldering in electrical engineering, electromechanics and electronic engineering.The soldering flux is characterized by high temperature resistance and does not sprinkle during the melting. As for non-ferrous metals, the light, solid flux residues of these solder wires do not cause corrosion.They can therefore remain on the solder joint. An optimal moistering as well as standard-surpassing spread values mark this lead-free solder wire a top product among the solder wires. The soldering flux formulation "Clear" is based on synthetic resins (rosin-free) and perfectly matches the actual requirements of the new lead-free soldering method. • high speed of moisturing and spreading • no (painful) flux splashes• crystal clear flux residues• lowest gas emission and neutral odor• easy removal of residues on soldering tips• 100MΩ test passed - even suitable in assembly production • the service life of the soldering iron tips is extended significantlyFELDER ISO-Core®-solder wires are manufactured of the same high-purity alloy components according to international standards such as FELDER ISO-Tin®-electronic solders.

Solder wire for hand soldering and automatic soldering in electrical engineering, electromechanics and electronic engineering. The soldering flux is characterized by high temperature resistance and does not sprinkle during the melting. As for non-ferrous metals, the light, solid flux residues of these solder wires do not cause corrosion.They can therefore remain on the solder joint. An optimal moistering as well as standard-surpassing spread values mark this lead-free solder wire a top product among the solder wires. The soldering flux formulation "Clear" is based on synthetic resins (rosin-free) and perfectly matches the actual requirements of the new lead-free soldering method. • high speed of moisturing and spreading • no (painful) flux splashes • crystal clear flux residues • lowest gas emission and neutral odor • easy removal of residues on soldering tips • 100MΩ test passed - even suitable in assembly production • the service life of the soldering iron tips is extended significantly FELDER ISO-Core®-solder wires are manufactured of the same high-purity alloy components according to international standards such as FELDER ISO-Tin®-electronic solders.

Solder wire for hand soldering and automatic soldering in electrical engineering, electromechanics and electronic engineering.The soldering flux is characterized by high temperature resistance and does not sprinkle during the melting. As for non-ferrous metals, the light, solid flux residues of these solder wires do not cause corrosion.They can therefore remain on the solder joint. An optimal moistering as well as standard-surpassing spread values mark this lead-free solder wire a top product among the solder wires. The soldering flux formulation "Clear" is based on synthetic resins (rosin-free) and perfectly matches the actual requirements of the new lead-free soldering method. • high speed of moisturing and spreading • no (painful) flux splashes• crystal clear flux residues• lowest gas emission and neutral odor• easy removal of residues on soldering tips• 100MΩ test passed - even suitable in assembly production • the service life of the soldering iron tips is extended significantlyFELDER ISO-Core®-solder wires are manufactured of the same high-purity alloy components according to international standards such as FELDER ISO-Tin®-electronic solders.

Solder wire for hand soldering and automatic soldering in electrical engineering, electromechanics and electronic engineering.The soldering flux is characterized by high temperature resistance and does not sprinkle during the melting. As for non-ferrous metals, the light, solid flux residues of these solder wires do not cause corrosion.They can therefore remain on the solder joint. An optimal moistering as well as standard-surpassing spread values mark this lead-free solder wire a top product among the solder wires. The soldering flux formulation "Clear" is based on synthetic resins (rosin-free) and perfectly matches the actual requirements of the new lead-free soldering method. • high speed of moisturing and spreading • no (painful) flux splashes• crystal clear flux residues• lowest gas emission and neutral odor• easy removal of residues on soldering tips• 100MΩ test passed - even suitable in assembly production • the service life of the soldering iron tips is extended significantlyThe alloy Sn99Cu1(NiGe), is about a so-called eutectic alloy. Eutectic alloys dispose of a lower melting point than the constituent pure substances and melt and solidify respectively just as a pure substance at a fixed temperature.Eutectic alloys have a melting point which is easy to determine. At the same time, this melting point is the lowest of all mixtures of the same components. Mixtures with other proportions of alloying elements, however, have a melting and solidifying range in which apart from the melting there is also a solid phase.In eutectics all components solidify at the same time. As this happens at a much lower temperatrue than it would be the case with the pure components, a fine and uniform structure is created (lattice).FELDER ISO-Core®-solder wires are manufactured of the same high-purity alloy components according to international standards such as FELDER ISO-Tin®-electronic solders.Felder GMBH produces all NiGe-alloys with the license for the Fuji-patents:DE-patent-No. 19816671C2US-patent-No 6.179.935B1Japan-patent-No. 3296289

Solder wire for hand soldering and automatic soldering in electrical engineering, electromechanics and electronic engineering.The soldering flux is characterized by high temperature resistance and does not sprinkle during the melting. As for non-ferrous metals, the light, solid flux residues of these solder wires do not cause corrosion.They can therefore remain on the solder joint. An optimal moistering as well as standard-surpassing spread values mark this lead-free solder wire a top product among the solder wires. The soldering flux formulation "Clear" is based on synthetic resins (rosin-free) and perfectly matches the actual requirements of the new lead-free soldering method. • high speed of moisturing and spreading • no (painful) flux splashes• crystal clear flux residues• lowest gas emission and neutral odor• easy removal of residues on soldering tips• 100MΩ test passed - even suitable in assembly production • the service life of the soldering iron tips is extended significantlyFELDER ISO-Core®-solder wires are manufactured of the same high-purity alloy components according to international standards such as FELDER ISO-Tin®-electronic solders.

Solder wire for hand soldering and automatic soldering in electrical engineering, electromechanics and electronic engineering.The soldering flux is characterized by high temperature resistance and does not sprinkle during the melting. As for non-ferrous metals, the light, solid flux residues of these solder wires do not cause corrosion.They can therefore remain on the solder joint. An optimal moistering as well as standard-surpassing spread values mark this lead-free solder wire a top product among the solder wires. The soldering flux formulation "Clear" is based on synthetic resins (rosin-free) and perfectly matches the actual requirements of the new lead-free soldering method. • high speed of moisturing and spreading • no (painful) flux splashes• crystal clear flux residues• lowest gas emission and neutral odor• easy removal of residues on soldering tips• 100MΩ test passed - even suitable in assembly production • the service life of the soldering iron tips is extended significantlyThe alloy Sn99Cu1(NiGe), is about a so-called eutectic alloy. Eutectic alloys dispose of a lower melting point than the constituent pure substances and melt and solidify respectively just as a pure substance at a fixed temperature.Eutectic alloys have a melting point which is easy to determine. At the same time, this melting point is the lowest of all mixtures of the same components. Mixtures with other proportions of alloying elements, however, have a melting and solidifying range in which apart from the melting there is also a solid phase.In eutectics all components solidify at the same time. As this happens at a much lower temperatrue than it would be the case with the pure components, a fine and uniform structure is created (lattice).FELDER ISO-Core®-solder wires are manufactured of the same high-purity alloy components according to international standards such as FELDER ISO-Tin®-electronic solders.Felder GMBH produces all NiGe-alloys with the license for the Fuji-patents:DE-patent-No. 19816671C2US-patent-No 6.179.935B1Japan-patent-No. 3296289

Solder wire for hand soldering and automatic soldering in electrical engineering, electromechanics and electronic engineering.The soldering flux is characterized by high temperature resistance and does not sprinkle during the melting. As for non-ferrous metals, the light, solid flux residues of these solder wires do not cause corrosion.They can therefore remain on the solder joint. An optimal moistering as well as standard-surpassing spread values mark this lead-free solder wire a top product among the solder wires. The soldering flux formulation "Clear" is based on synthetic resins (rosin-free) and perfectly matches the actual requirements of the new lead-free soldering method. • high speed of moisturing and spreading • no (painful) flux splashes• crystal clear flux residues• lowest gas emission and neutral odor• easy removal of residues on soldering tips• 100MΩ test passed - even suitable in assembly production • the service life of the soldering iron tips is extended significantlyThe alloy Sn99Cu1(NiGe), is about a so-called eutectic alloy. Eutectic alloys dispose of a lower melting point than the constituent pure substances and melt and solidify respectively just as a pure substance at a fixed temperature.Eutectic alloys have a melting point which is easy to determine. At the same time, this melting point is the lowest of all mixtures of the same components. Mixtures with other proportions of alloying elements, however, have a melting and solidifying range in which apart from the melting there is also a solid phase.In eutectics all components solidify at the same time. As this happens at a much lower temperatrue than it would be the case with the pure components, a fine and uniform structure is created (lattice).FELDER ISO-Core®-solder wires are manufactured of the same high-purity alloy components according to international standards such as FELDER ISO-Tin®-electronic solders.Felder GMBH produces all NiGe-alloys with the license for the Fuji-patents:DE-patent-No. 19816671C2US-patent-No 6.179.935B1Japan-patent-No. 3296289

Solder wire for hand soldering and automatic soldering in electrical engineering, electromechanics and electronic engineering.The soldering flux is characterized by high temperature resistance and does not sprinkle during the melting. As for non-ferrous metals, the light, solid flux residues of these solder wires do not cause corrosion.They can therefore remain on the solder joint. An optimal moistering as well as standard-surpassing spread values mark this lead-free solder wire a top product among the solder wires. The soldering flux formulation "Clear" is based on synthetic resins (rosin-free) and perfectly matches the actual requirements of the new lead-free soldering method. • high speed of moisturing and spreading • no (painful) flux splashes• crystal clear flux residues• lowest gas emission and neutral odor• easy removal of residues on soldering tips• 100MΩ test passed - even suitable in assembly production • the service life of the soldering iron tips is extended significantlyThe alloy Sn99Cu1(NiGe), is about a so-called eutectic alloy. Eutectic alloys dispose of a lower melting point than the constituent pure substances and melt and solidify respectively just as a pure substance at a fixed temperature.Eutectic alloys have a melting point which is easy to determine. At the same time, this melting point is the lowest of all mixtures of the same components. Mixtures with other proportions of alloying elements, however, have a melting and solidifying range in which apart from the melting there is also a solid phase.In eutectics all components solidify at the same time. As this happens at a much lower temperatrue than it would be the case with the pure components, a fine and uniform structure is created (lattice).FELDER ISO-Core®-solder wires are manufactured of the same high-purity alloy components according to international standards such as FELDER ISO-Tin®-electronic solders.Felder GMBH produces all NiGe-alloys with the license for the Fuji-patents:DE-patent-No. 19816671C2US-patent-No 6.179.935B1Japan-patent-No. 3296289

Solder wire for hand soldering and automatic soldering in electrical engineering, electromechanics and electronic engineering.The soldering flux is characterized by high temperature resistance and does not sprinkle during the melting. As for non-ferrous metals, the light, solid flux residues of these solder wires do not cause corrosion.They can therefore remain on the solder joint. An optimal moistering as well as standard-surpassing spread values mark this lead-free solder wire a top product among the solder wires. The soldering flux formulation "Clear" is based on synthetic resins (rosin-free) and perfectly matches the actual requirements of the new lead-free soldering method. • high speed of moisturing and spreading • no (painful) flux splashes• crystal clear flux residues• lowest gas emission and neutral odor• easy removal of residues on soldering tips• 100MΩ test passed - even suitable in assembly production • the service life of the soldering iron tips is extended significantlyFELDER ISO-Core®-solder wires are manufactured of the same high-purity alloy components according to international standards such as FELDER ISO-Tin®-electronic solders.

Solder wire for hand soldering and automatic soldering in electrical engineering, electromechanics and electronic engineering.The soldering flux is characterized by high temperature resistance and does not sprinkle during the melting. As for non-ferrous metals, the light, solid flux residues of these solder wires do not cause corrosion.They can therefore remain on the solder joint. An optimal moistering as well as standard-surpassing spread values mark this lead-free solder wire a top product among the solder wires. The soldering flux formulation "Clear" is based on synthetic resins (rosin-free) and perfectly matches the actual requirements of the new lead-free soldering method. • high speed of moisturing and spreading • no (painful) flux splashes• crystal clear flux residues• lowest gas emission and neutral odor• easy removal of residues on soldering tips• 100MΩ test passed - even suitable in assembly production • the service life of the soldering iron tips is extended significantlyThe alloy Sn99Cu1(NiGe), is about a so-called eutectic alloy. Eutectic alloys dispose of a lower melting point than the constituent pure substances and melt and solidify respectively just as a pure substance at a fixed temperature.Eutectic alloys have a melting point which is easy to determine. At the same time, this melting point is the lowest of all mixtures of the same components. Mixtures with other proportions of alloying elements, however, have a melting and solidifying range in which apart from the melting there is also a solid phase.In eutectics all components solidify at the same time. As this happens at a much lower temperatrue than it would be the case with the pure components, a fine and uniform structure is created (lattice).FELDER ISO-Core®-solder wires are manufactured of the same high-purity alloy components according to international standards such as FELDER ISO-Tin®-electronic solders.Felder GMBH produces all NiGe-alloys with the license for the Fuji-patents:DE-patent-No. 19816671C2US-patent-No 6.179.935B1Japan-patent-No. 3296289

Problems with the desoldering can be resolved easily with the desoldering wick. A desoldering wick is a band of braided copper wires, soaked in soldering flux in order to improve the capillary action.The flux-soaked desoldering wick takes in the solder tin after a short heating period with the soldering iron. The component can be removed. By using the desoldering wick, components are protected from excessive heat and the components can be removed easily. With a bit of practice it is even possible to keep THT-solder joints from the perpendicular that the component can be pulled without any effort from the through-connection.The desoldering wick is suitable for desoldering of components and for the elimination of remaining perpendicular on printed circuit boards.NoteDue to the high thermal conductivity there is the risk of burning. Therefore, it is advisable not to touch the desoldering wick directly during the process but to hold it firmly on the folding coil!

The Felder Tinner cleans and tins unwettable and oxidized soldering tips. The tinner gently removes even resistant oxide layers on the tips. Free of lead and halogens.ApplicationThe hot soldering tip is tripped on the surface of the regeneration paste. The soldering tips regain their ability of moisturing. The durability of life can be extended significantly.

Problems with the desoldering can be resolved easily with the desoldering wick. A desoldering wick is a band of braided copper wires, soaked in soldering flux in order to improve the capillary action.The flux-soaked desoldering wick takes in the solder tin after a short heating period with the soldering iron. The component can be removed. By using the desoldering wick, components are protected from excessive heat and the components can be removed easily. With a bit of practice it is even possible to keep THT-solder joints from the perpendicular that the component can be pulled without any effort from the through-connection.The desoldering wick is suitable for desoldering of components and for the elimination of remaining perpendicular on printed circuit boards.NoteDue to the high thermal conductivity there is the risk of burning. Therefore, it is advisable not to touch the desoldering wick directly during the process but to hold it firmly on the folding coil!

Problems with the desoldering can be resolved easily with the desoldering wick. A desoldering wick is a band of braided copper wires, soaked in soldering flux in order to improve the capillary action.The flux-soaked desoldering wick takes in the solder tin after a short heating period with the soldering iron. The component can be removed. By using the desoldering wick, components are protected from excessive heat and the components can be removed easily. With a bit of practice it is even possible to keep THT-solder joints from the perpendicular that the component can be pulled without any effort from the through-connection.The desoldering wick is suitable for desoldering of components and for the elimination of remaining perpendicular on printed circuit boards.NoteDue to the high thermal conductivity there is the risk of burning. Therefore, it is advisable not to touch the desoldering wick directly during the process but to hold it firmly on the folding coil!

Problems with the desoldering can be resolved easily with the desoldering wick. A desoldering wick is a band of braided copper wires, soaked in soldering flux in order to improve the capillary action.The flux-soaked desoldering wick takes in the solder tin after a short heating period with the soldering iron. The component can be removed. By using the desoldering wick, components are protected from excessive heat and the components can be removed easily. With a bit of practice it is even possible to keep THT-solder joints from the perpendicular that the component can be pulled without any effort from the through-connection.The desoldering wick is suitable for desoldering of components and for the elimination of remaining perpendicular on printed circuit boards.NoteDue to the high thermal conductivity there is the risk of burning. Therefore, it is advisable not to touch the desoldering wick directly during the process but to hold it firmly on the folding coil!

Problems with the desoldering can be resolved easily with the desoldering wick. A desoldering wick is a band of braided copper wires, soaked in soldering flux in order to improve the capillary action.The flux-soaked desoldering wick takes in the solder tin after a short heating period with the soldering iron. The component can be removed. By using the desoldering wick, components are protected from excessive heat and the components can be removed easily. With a bit of practice it is even possible to keep THT-solder joints from the perpendicular that the component can be pulled without any effort from the through-connection.The desoldering wick is suitable for desoldering of components and for the elimination of remaining perpendicular on printed circuit boards.NoteDue to the high thermal conductivity there is the risk of burning. Therefore, it is advisable not to touch the desoldering wick directly during the process but to hold it firmly on the folding coil!