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AOYUE LE82PM965 Reballing BGA Template 0.50 mm

Product information "AOYUE LE82PM965 Reballing BGA Template 0.50 mm"

For secure reballing of BGA chips:
• Secure fixing of the BGA chip for rebaling
• Safe and clean reballing at low cost
• Around 50 additional templates available

Reballing in just a few steps:
• Place the precision template that corresponds exactly to the connection grid of the BGA.
• The solder balls are then distributed over the pads. Once all pads have received a solder ball, the excess solder balls are removed.
• The solder balls can now be melted onto the pads.
• After the template and BGA have cooled down, the template is removed.
Properties "AOYUE LE82PM965 Reballing BGA Template 0.50 mm"
Battery required: No